The SISPAD conference series provides an open forum for the presentation of the latest results and trends in modelling and simulation of devices, processes and equipment for integrated circuits.
Date and Location:
Conference date: September 3-5, 2013
Conference location: The Grand Central Hotel, Glasgow, Scotland, UK
Abstract submission deadline: April 1, 2013
Webpage: www.sispad2013.org
Scientific scope:
Original papers are solicited in the following subject areas:
? Device Modelling and Simulation
? Process Modelling and Simulation
? Compact Modelling
? Process/device/circuit simulation in context with system design and verification
? Equipment, topography, lithography modelling and algorithms
? Interconnect modelling and algorithms including noise and parasitic effects
? Simulation of process, layout and purely statistical variability
? Advanced numerical methods and algorithms
? Fundamental aspects of device modelling and simulation
? Simulation of sensors, biosensors and electro-mechanical systems
Abstract Submission:
The abstract should describe the nature of the presentation, together with references. The abstract is limited to two pages (1 page of text , 1 page of figures). Abstracts should be submitted in PDF format. Submission information will be posted on the web site.
Further Information:
For more information please visit www.sispad2013.org.
Source: http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=26862©ownerid=8751
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